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No. STSE-CC6018A
SPECIFICATIONS FOR NICHIA CHIP TYPE WHITE
MODEL : NESW005T
LED
NICHIA CORPORATION
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Nichia STSE-CC6018A
1.SPECIFICATIONS
(1) Absolute Maximum Ratings Item Forward Current Pulse Forward Current Reverse Voltage Power Dissipation Operating Temperature Storage Temperature Soldering Temperature
IFP Conditions :
Symbol IF IFP VR PD Topr Tstg Tsld
Absolute Maximum Rating 15 50 5 60 -30 ~ + 85 -40 ~ +100 Reflow Soldering : 260C Hand Soldering : 350C
and Duty < 1/10 =
(Ta=25C) Unit mA mA V mW C C for 10sec. for 3sec.
Pulse Width < 10msec. =
(2) Initial Electrical/Optical Characteristics Item Symbol Forward Voltage VF Reverse Current IR Luminous Intensity Iv x Chromaticity Coordinate y Please refer to CIE 1931 chromaticity diagram.
Condition IF=10[mA] VR= 5[V] IF=10[mA] IF=10[mA] IF=10[mA]
Typ. (3.6) (290) 0.31 0.32
(Ta=25C) Max. Unit 4.0 V 50 A mcd -
(3) Ranking Item Luminous Intensity Rank Q Rank P Rank O Symbol Iv Iv Iv Condition IF=10[mA] IF=10[mA] IF=10[mA] Min. 300 210 150
(Ta=25C) Max. Unit 420 mcd 300 mcd 210 mcd
Luminous Intensity Measurement allowance is 10%.
Color Ranks x y x y 0.280 0.248 0.296 0.276 Rank a0 0.264 0.283 0.267 0.305 Rank b2 0.287 0.330 0.295 0.339 0.296 0.276 0.330 0.318 x y x y 0.287 0.295 0.330 0.318
(IF=10mA,Ta=25C) Rank b1 0.283 0.330 0.330 0.305 0.360 0.339 Rank c0 0.330 0.361 0.360 0.385 0.356 0.351
Color Coordinates Measurement allowance is 0.01. One delivery will include up to two consecutive color ranks and three luminous intensity ranks of the products. The quantity-ratio of the ranks is decided by Nichia.
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Nichia STSE-CC6018A-2
2. INITIAL
OPTICAL/ELECTRICAL
CHARACTERISTICS
Please refer to figure's page.
3.OUTLINE
DIMENSIONS
AND
MATERIALS
: : : Black Glass Fabric Based-Epoxy Resin Silicone Resin (with Diffused + Phosphor) Ag Plating Copper
Please refer to figure's page. Material as follows ; Package Encapsulating Resin Electrodes
4.PACKAGING
* The LEDs are packed in cardboard boxes after taping. Please refer to figure's page. The label on the minimum packing unit shows ; Part Number, Lot Number, Ranking, Quantity * In order to protect the LEDs from mechanical shock, we pack them in cardboard boxes for transportation. * The LEDs may be damaged if the boxes are dropped or receive a strong impact against them, so precautions must be taken to prevent any damage. * The boxes are not water resistant and therefore must be kept away from water and moisture. * When the LEDs are transported, we recommend that you use the same packing method as Nichia.
5.LOT
NUMBER
The first six digits number shows lot number. The lot number is composed of the following characters; - Year ( 5 for 2005, 6 for 2006 ) - Month ( 1 for Jan., 9 for Sep., A for Oct., - Nichia's Product Number - Ranking by Color Coordinates - Ranking by Luminous Intensity
B for Nov. )
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Nichia STSE-CC6018A
6.RELIABILITY
(1) TEST ITEMS AND RESULTS
Test Item Resistance to Soldering Heat (Reflow Soldering) Thermal Shock Temperature Cycle Moisture Resistance Cyclic High Temperature Storage Temperature Humidity Storage Low Temperature Storage Steady State Operating Life Steady State Operating Life of High Humidity Heat Steady State Operating Life of Low Temperature Standard Test Method JEITA ED-4701 300 301 JEITA ED-4701 300 307 JEITA ED-4701 100 105 JEITA ED-4701 200 203 JEITA ED-4701 200 201 JEITA ED-4701 100 103 JEITA ED-4701 200 202 Test Conditions Tsld=260C, 10sec. (Pre treatment 30C,70%,168hrs.) 0C ~ 100C 15sec. 15sec. -40C ~ 25C ~ 100C ~ 25C 30min. 5min. 30min. 5min. 25C ~ 65C ~ -10C 90%RH 24hrs./1cycle Ta=100C Ta=60C, Ta=-40C Ta=25C, IF=15mA 60C, RH=90%, IF=10mA Ta=-30C, IF=10mA RH=90% Note 2 times Number of Damaged 0/100
100 cycles 100 cycles 10 cycles 1000 hrs. 1000 hrs. 1000 hrs. 1000 hrs. 500 hrs. 1000 hrs.
0/100 0/100 0/100 0/100 0/100 0/100 0/100 0/100 0/100
(2) CRITERIA FOR JUDGING DAMAGE Item Symbol Test Conditions Forward Voltage VF IF=10mA U.S.L.*) Reverse Current IR VR=5V U.S.L.*) Luminous Intensity IV IF=10mA L.S.L.**) 0.7 *) U.S.L. : Upper Standard Level **) L.S.L. : Lower Standard Level Criteria for Judgement Min. Max. 1.1 2.0
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Nichia STSE-CC6018A-2
7.CAUTIONS
The LEDs are devices which are materialized by combining Blue LEDs and special phosphors. Consequently, the color of the LEDs is changed a little by an operating current. Care should be taken after due consideration when using LEDs. (1) Moisture Proof Package * When moisture is absorbed into the SMT package it may vaporize and expand during soldering. There is a possibility that this can cause exfoliation of the contacts and damage to the optical characteristics of the LEDs. For this reason, the moisture proof package is used to keep moisture to a minimum in the package. * The moisture proof package is made of an aluminum moisture proof bag. A package of a moisture absorbent material (silica gel) is inserted into the aluminum moisture proof bag. The silica gel changes its color from blue to pink as it absorbs moisture. (2) Storage * Storage Conditions Before opening the package : The LEDs should be kept at 30C or less and 90%RH or less. The LEDs should be used within a year. When storing the LEDs, moisture proof packaging with absorbent material (silica gel) is recommended. After opening the package : The LEDs should be kept at 30C or less and 70%RH or less. The LEDs should be soldered within 168 hours (7days) after opening the package. If unused LEDs remain, they should be stored in moisture proof packages, such as sealed containers with packages of moisture absorbent material(silica gel). It is also recommended to return the LEDs to the original moisture proof bag and to reseal the moisture proof bag again. * If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions. Baking treatment : more than 24 hours at 65 5C * Nichia LED electrodes and leadframes are silver plated copper. The silver surface may be affected by environments which contain corrosive substances. Please avoid conditions which may cause the LED to corrode, tarnish or discolor. This corrosion or discoloration might lower solderability or might affect on optical characteristics. * Please avoid rapid transitions in ambient temperature, especially in high humidity environments where condensation can occur. (3) Heat Generation * Thermal design of the end product is of paramount importance. Please consider the heat generation of the LED when making the system design. The coefficient of temperature increase per input electric power is affected by the thermal resistance of the circuit board and density of LED placement on the board, as well as other components. It is necessary to avoid intense heat generation and operate within the maximum ratings given in this specification. * The operating current should be decided after considering the ambient maximum temperature of LEDs.
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Nichia STSE-CC6018A-2 (4) Soldering Conditions * The LEDs can be soldered in place using the reflow soldering method. Nichia cannot make a guarantee on the LEDs after they have been assembled using the dip soldering method. * Recommended soldering conditions
Pre-heat Pre-heat time Peak temperature Soldering time Condition Reflow Soldering Lead Solder Lead-free Solder 180 ~ 200C 120 ~ 150C 120 sec. Max. 120 sec. Max. 240C Max. 260C Max. 10 sec. Max. 10 sec. Max. refer to refer to Temperature - profile 1. Temperature - profile 2. (N2 reflow is recommended.) Hand Soldering Temperature Soldering time 350C Max. 3 sec. Max. (one time only)
Although the recommended soldering conditions are specified in the above table, reflow or hand soldering at the lowest possible temperature is desirable for the LEDs. A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature. [Temperature-profile (Surface of circuit board)] Use the conditions shown to the under figure.
<1 : Lead Solder>
2.5 ~ 5C / sec. Pre-heating 120 ~ 150C 60sec.Max.
Above 200C
<2 : Lead-free Solder>
1~ 5C / sec. 240C Max. 10sec. Max. 1~ 5C / sec. Pre-heating 180 ~ 200C 60sec.Max.
Above 220C
260C Max. 10sec. Max.
2.5 ~ 5C / sec.
120sec.Max.
120sec.Max.
[Recommended soldering pad design] Use the following conditions shown in the figure.
0.9 1.3 3.4 1.3 0.9 2.1
(Unit : mm)
* Occasionally there is a brightness decrease caused by the influence of heat or ambient atmosphere during air reflow. It is recommended that the User use the nitrogen reflow method. * The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on the top of package. The pressure to the top surface will be influence to the reliability of the LEDs. Precautions should be taken to avoid the strong pressure on the encapsulated part. So when using the chip mounter, the picking up nozzle that does not affect the silicone resin should be used. * Touching the LED surface, at the time of hand soldering or adjustment after mounting, might damage its surface and cause open-wire. Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used. It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. * Reflow soldering should not be done more than two times. * When soldering, do not put stress on the LEDs during heating. * After soldering, do not warp the circuit board.
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Nichia STSE-CC6018A-2 (5) Cleaning * It is recommended that isopropyl alcohol be used as a solvent for cleaning the LEDs. When using other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the resin or not. Freon solvents should not be used to clean the LEDs because of worldwide regulations. * Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition. Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs will occur. (6) Static Electricity * Static electricity or surge voltage damages the LEDs. It is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs. * All devices, equipment and machinery must be properly grounded. It is recommended that precautions be taken against surge voltage to the equipment that mounts the LEDs. * When inspecting the final products in which LEDs were assembled, it is recommended to check whether the assembled LEDs are damaged by static electricity or not. It is easy to find static-damaged LEDs by a light-on test or a VF test at a lower current (below 1mA is recommended). * Damaged LEDs will show some unusual characteristics such as the leak current remarkably increases, the forward voltage becomes lower, or the LEDs do not light at the low current. Criteria : (VF > 2.0V at IF=0.5mA) (7) Others * NESW005 complies with RoHS Directive. * Care must be taken to ensure that the reverse voltage will not exceed the absolute maximum rating when using the LEDs with matrix drive. * The LED light output is strong enough to injure human eyes. Precautions must be taken to prevent looking directly at the LEDs with unaided eyes for more than a few seconds. * Flashing lights have been known to cause discomfort in people; you can prevent this by taking precautions during use. Also, people should be cautious when using equipment that has had LEDs incorporated into it. * The LEDs described in this brochure are intended to be used for ordinary electronic equipment (such as office equipment, communications equipment, measurement instruments and household appliances). Consult Nichia's sales staff in advance for information on the applications in which exceptional quality and reliability are required, particularly when the failure or malfunction of the LEDs may directly jeopardize life or health (such as for airplanes, aerospace, submersible repeaters, nuclear reactor control systems, automobiles, traffic control equipment, life support systems and safety devices). * User shall not reverse engineer by disassembling or analysis of the LEDs without having prior written consent from Nichia. When defective LEDs are found, the User shall inform Nichia directly before disassembling or analysis. * The formal specifications must be exchanged and signed by both parties before large volume purchase begins. * The appearance and specifications of the product may be modified for improvement without notice.
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Nichia STSE-CC6018A
ICI Chromaticity Diagram
0.9 520 530 0.8 540 510 0.7 550
560 0.6 570 500 0.5 580 590 0.4 600
y
b1
0.3 490
c0 b2
610 620 630
a0
0.2
480 0.1 470 460
0
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
x
Color Coordinates Measurement allowance is 0.01.
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Forward Voltage vs. Forward Current
100 Forward Current IFP (mA) 50 20 10 5 Ta=25C Relative Luminosity (a.u.)
Forward Current vs. Relative Luminosity
4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 0 10 20 30 40 50 60 Forward Current IFP (mA) Ta=25C Allowable Forward Current IFP (mA)
Duty Ratio vs. Allowable Forward Current
100 Ta=25C 50
20 15 10 1 5 10 20 50 100 Duty Ratio (%)
1 2.5
3.0 3.5 4.0 4.5 5.0 Forward Voltage VF (V)
Ambient Temperature vs. Forward Voltage
IFP=10mA Relative Luminosity (a.u.)
Ambient Temperature vs. Relative Luminosity
Allowable Forward Current IF (mA) 2.0 IFP=10mA 1.0
Ambient Temperature vs. Allowable Forward Current
25 20 15 10 5 3.7 0
Forward Voltage VF (V)
-8-
5.0 4.6 4.2 3.8 3.4 3.0 2.6 -40 -20 0 20 40 60 80 100 Ambient Temperature Ta (C)
0.5
0.2 -40 -20 0 20 40 60 80 100 Ambient Temperature Ta (C)
0
20 40 60 80 100 Ambient Temperature Ta (C)
Nichia STSE-CC6018A
Model
NESW005
NICHIA CORPORATION
Title No.
CHARACTERISTICS
051228548261
Forward Current vs. Chromaticity Coordinate
Relative Emission Intensity (a.u.)
Spectrum
1.2 1.0 0.8 0.6 0.4 0.2 0 350 450 550 650 Wavelength (nm) 750 Ta=25C IF=10mA
0.35 Ta=25C 0.34 0.33
1mA 5mA 10mA 50mA
y
0.32 0.31
0.30 0.29 0.30 0.31 0.32 0.33 0.34
x Ambient Temperature vs. Chromaticity Coordinate
0.35
Relative Luminosity (a.u.)
Directivity
1.0 0 Ta=25C IFP=10mA 10 20 30 40 50 0.5 60 70 80 0 90 60 30 Radiation Angle 0 0.5 90 1.0
y
-9-
IFP=10mA 0.34 0.33 0.32 0.31
85C 0C 25C 50C -30C
0.30 0.29 0.30 0.31 0.32 0.33 0.34
x
Nichia STSE-CC6018A
Model
NESW005
NICHIA CORPORATION
Title No.
CHARACTERISTICS
051228548271
2.1 (1.75) (0.3)
NC
(0.3) (0.8)
Cathode
0.75 0.5
(1.75)
2.1
Anode
NC
ITEM PACKAGE
0.9
MATERIALS Black Glass Fabric Based-Epoxy Resin Silicone Resin (with Diffused + Phosphor) Ag Plating Copper
ENCAPSULATING RESIN ELECTRODES
1.1
-10-
Nichia
K
A
Model
STSE-CC6018A-2
NESW005
Unit mm 20/1 Scale Allow
NICHIA CORPORATION
Title No.
OUTLINE DIMENSIONS
061002548292
1.750.1
Taping part
1.5+0.1 -0 40.1 20.05
0.250.05
Reel part
180+0 -3
11.41 90.3
8+0.3 - 0.1
Cathode
3.50.05
2.390.1
2 1 0.8
(2.75)
13
0.2
40.1
10.25
2.390.1
0.970.1
Label
XXXX LED
TYPE NxSx005T LOT XXXXXXQTY pcs
Reel End of tape
No LEDs LEDs mounting part No LEDs
60+1 -0
-11Pull direction Embossed carrier tape Reel Lead Min.160mm (No LEDs)
Reel Lead Min.100mm (No LEDs)
Top cover tape
Reel Lead Min.400mm
Nichia STSE-CC6018A-3
3,500pcs/Reel Model
Taping is based on the JIS C 0806 : Packaging of Electronic Components on Continuous Tapes.
NxSx005T
Unit mm Scale Allow
NICHIA CORPORATION
Title No.
TAPING DIMENSIONS
060427651841
Nichia STSE-CC6018A
The reel and moisture absorbent material are put in the moisture proof foil bag and then heat sealed. Reel Label
Seal
NICHIA
WHITE LED
TYPE LOT QTY NESW005T xxxxxxPCS
NICHIA CORPORATION
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
Moisture absorbent material
Moisture proof foil bag
The box is partitioned with the cardboard.
Label
NICHIA
Nichia
LED
WHITE LED
TYPE RANK QTY NESW005T PCS
NICHIA CORPORATION
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
Packing unit
Moisture proof foil bag Cardboard box Cardboard box S Cardboard box M Cardboard box L Reel/bag 1reel Quantity/bag (pcs) 3,500 MAX. Reel/box 7reel MAX. 15reel MAX. 30reel MAX. Quantity/box (pcs) 24,500 MAX. 52,500 MAX. 105,000 MAX.
Dimensions (mm) 291 237 120 8t 259 247 243 5t 444 262 259 8t
Model
NESW005T
NICHIA CORPORATION
Title No.
PACKING
051228548331
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